Responsible for leading all efforts related to focal plane array (FPA) development post epi growth. The candidate is responsible for frontend processes (detector array fabrication and indium bump application), ROIC processing (indium bump application), hybridization, and backend processing (shimming, polishing, AR coating), and Final Assembly (wirebonding, electronics assembly, mechanical assembly). The ideal candidate is focused on leading a team capable of executing in an efficient high-mix production environment. This individual is responsible for evaluating current processes, determining best practices, setting process configurations, and continuously seeking improvements.

The role is relied on to provide cost/schedule/risk inputs for all FPA build activities and maintain execution activities within scope. This includes responsibility for managing FPA builds through the relevant queues and cycles of the process.

The successful candidate also develops and maintains the necessary infrastructure (people, training, and equipment) interacts with a cross-disciplinary team and ensures solutions are integrated, operational, certified, and well maintained.

Ability to lead a team, promote creativity, and foster a can-do results drive culture.

Track record of success in one or more of the following areas: IR detector processing, hybridization, backend processing, AR coating, and production processes including a passion for making them as efficient as possible. This will be achieved by using various principles of engineering, technology, manufacturing and management science.

Experience with manufacturing and industrial engineering is considered a bonus.

Demonstrated ability to specify, integrate, and operate complex custom

equipment covering the full range of FPA development.

Understanding of photoconductors, semiconductor device physics, IR development/production engineering, and basic radiometry test practices covering visible and IR wavelengths is required. Familiarity with programming environments, databases, and hardware/firmware configuration control is required. Must be knowledgeable with cleanroom environments and equipment, control software packages, and data analysis tools. Exposure to development principals such as: agile tenants, iterative design, and small batch processing is highly desirable.

Required Education:

MS or BS in Physics, Material Science, Electronic Engineering, Mechanical Engineering, Industrial Engineering, or related fields

KEYWORDS: IR Sensor, Focal Plane Array, focal planes, Production, Testing, Characterization, Imaging Sensor, Sensors, ROIC, photonics, Focal Plane Engineer, Production Engineer

Proficiency in use of computers, engineering work stations, IR FPA production

equipment, test equipment, verbal and written communication, interaction with customers/colleagues, and a team-oriented/fast-paced environment.

Must be a U.S. person.

Ability to obtain/maintain security clearances (post-start) is a plus.

The base salary range for this full-time position is $145,745 - $186,688 + bonus + benefits.

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.